JPH025295B2 - - Google Patents

Info

Publication number
JPH025295B2
JPH025295B2 JP58134369A JP13436983A JPH025295B2 JP H025295 B2 JPH025295 B2 JP H025295B2 JP 58134369 A JP58134369 A JP 58134369A JP 13436983 A JP13436983 A JP 13436983A JP H025295 B2 JPH025295 B2 JP H025295B2
Authority
JP
Japan
Prior art keywords
wafer
periphery
light
temperature
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58134369A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6027115A (ja
Inventor
Hiroshi Shimizu
Tetsuharu Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Priority to JP13436983A priority Critical patent/JPS6027115A/ja
Publication of JPS6027115A publication Critical patent/JPS6027115A/ja
Publication of JPH025295B2 publication Critical patent/JPH025295B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
JP13436983A 1983-07-25 1983-07-25 光照射炉による半導体ウエハ−の熱処理法 Granted JPS6027115A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13436983A JPS6027115A (ja) 1983-07-25 1983-07-25 光照射炉による半導体ウエハ−の熱処理法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13436983A JPS6027115A (ja) 1983-07-25 1983-07-25 光照射炉による半導体ウエハ−の熱処理法

Publications (2)

Publication Number Publication Date
JPS6027115A JPS6027115A (ja) 1985-02-12
JPH025295B2 true JPH025295B2 (en]) 1990-02-01

Family

ID=15126764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13436983A Granted JPS6027115A (ja) 1983-07-25 1983-07-25 光照射炉による半導体ウエハ−の熱処理法

Country Status (1)

Country Link
JP (1) JPS6027115A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2778068B2 (ja) * 1988-12-14 1998-07-23 日本電気株式会社 半導体装置の熱処理方法
JPH09246202A (ja) * 1996-03-07 1997-09-19 Shin Etsu Handotai Co Ltd 熱処理方法および半導体単結晶基板
JP4712371B2 (ja) * 2004-12-24 2011-06-29 富士通セミコンダクター株式会社 半導体装置の製造方法
JP2014120664A (ja) * 2012-12-18 2014-06-30 Dainippon Screen Mfg Co Ltd 剥離補助方法および剥離補助装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59169125A (ja) * 1983-03-16 1984-09-25 Ushio Inc 半導体ウエハ−の加熱方法

Also Published As

Publication number Publication date
JPS6027115A (ja) 1985-02-12

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